Copper nanoparticles 3% dispersion in water

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Cu - nanoparticles, 3 wt.% aqueous dispersion

Stabilized with polyacrylic acid

Average particle size: 70 ± 20 nm

Can be used as a catalyst layer for electroless deposition of conductive coatings

Cu - nanoparticles, 3 wt.% aqueous dispersion

Stabilized with polyacrylic acid

Average particle size: 70 ± 20 nm

Can be used as a catalyst layer for electroless deposition of conductive coatings

Reference PL-CuPAA3