Copper nanoparticles 3% dispersion in water
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Cu - nanoparticles, 3 wt.% aqueous dispersion
Stabilized with polyacrylic acid
Average particle size: 70 ± 20 nm
Can be used as a catalyst layer for electroless deposition of conductive coatings
Cu - nanoparticles, 3 wt.% aqueous dispersion
Stabilized with polyacrylic acid
Average particle size: 70 ± 20 nm
Can be used as a catalyst layer for electroless deposition of conductive coatings
Reference PL-CuPAA3
Cu - nanoparticles, 3 wt.% aqueous dispersion
Stabilized with polyacrylic acid
Average particle size: 70 ± 20 nm
Can be used as a catalyst layer for electroless deposition of conductive coatings